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Development of high-power laser ablation process for polycrystalline diamond polishing Part 2: upscaling of PCD ultra-short pulsed laser ablation to high power

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Show simple item record Scalbert, William Tanner, David A. Holtz, Ronald 2020-10-28T09:00:25Z 2020-10-28T09:00:25Z 2020
dc.identifier.issn 0277-786X
dc.description peer-reviewed en_US
dc.description.abstract Properties of diamond are extreme. Since the first successful synthesis of diamond in 1955, the use of synthetic diamond has widely spread into diverse industries (e.g. manufacturing, electronics and optics). However, being the hardest material known, the manufacture of diamond material into an engineered tool is extremely challenging. The polishing process remains a traditional mechanical method existing for over hundreds of years. The development of alternative ways of polishing diamond is an active subject of research and has recently been investigated in topics such as chemically assisted mechanical polishing or ion beam polishing. Laser polishing is another alternative and a state-of-theart laser polishing method is presented in this paper. A high-power femtosecond laser ablation process is developed to achieve a high throughput polishing process of polycrystalline diamond composite (PCD) wafers. Laser ablation trials are carried out with a femtosecond laser delivering over 80W average power on three different PCD grades synthesized by high-pressure/higherature. The role of the fluence is highlighted and the effect of the burst mode on PCD is demonstrated for the first time to the best of our knowledge. Eventually, the roughness of the initial surface on fine grain diamond material is reduced by two while the ablation rate is twice higher than the removal rate achieved by mechanical polishing. en_US
dc.language.iso eng en_US
dc.publisher SPIE: The International Society for Optics and Photonics en_US
dc.relation 687880 en_US
dc.relation.ispartof Proceedings of SPIE - The International Society for Optical Engineering en
dc.relation.ispartofseries Proc. SPIE 11273, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems IX;1127303
dc.rights Copyright 2020 Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited. en_US
dc.subject ultra-short pulse laser en_US
dc.subject high-power laser en_US
dc.subject femtosecond laser en_US
dc.subject laser polishing en_US
dc.subject polycrystalline diamond en_US
dc.subject synthetic diamond en_US
dc.title Development of high-power laser ablation process for polycrystalline diamond polishing Part 2: upscaling of PCD ultra-short pulsed laser ablation to high power en_US
dc.type info:eu-repo/semantics/conferenceObject en_US
dc.type.supercollection all_ul_research en_US
dc.type.supercollection ul_published_reviewed en_US 2020-10-27T15:54:38Z
dc.description.version PUBLISHED
dc.identifier.doi 10.1117/12.2544963
dc.contributor.sponsor ERC en_US
dc.contributor.sponsor European Union (EU) en_US
dc.relation.projectid 687880 en_US
dc.rights.accessrights info:eu-repo/semantics/openAccess en_US
dc.internal.rssid 2952573
dc.internal.copyrightchecked Yes
dc.description.status peer-reviewed

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