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Improved reliability and mechanical performance of Sn58Bi solder alloys

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Show simple item record Ren, Guang Collins, Maurice N. 2019-05-10T10:26:51Z 2019-05-10T10:26:51Z 2019
dc.description peer-reviewed
dc.description.abstract Microstructural and mechanical properties of the eutectic Sn58Bi and micro-alloyed Sn57.6Bi0.4Ag solder alloys were compared. With the addition of Ag micro-alloy, the tensile strength was improved and this is attributed to a combination of microstructure refinement and an Ag3Sn precipitation hardening mechanism. However, ductility is slightly deteriorated due to the brittle nature of the Ag3Sn intermetallic compounds (IMCs). Additionally, a board level reliability study of Ag micro-alloyed Sn58Bi solder joints produced utilising a surface-mount technology (SMT) process, were assessed under accelerated temperature cycling (ATC) conditions. Results reveal that micro-alloyed Sn57.6Bi0.4Ag has a higher characteristic lifetime with a narrower failure distribution. This enhanced reliability corresponds with improved bulk mechanical properties. It is postulated that Ag3Sn IMCs are located at the Sn-Bi phase boundaries and suppress the solder microstructure from coarsening during the temperature cycling, hereby extending the time to failure. en_US
dc.language.iso eng en_US
dc.publisher MDPI en_US
dc.relation.ispartofseries Metals;9, pp.462
dc.subject Sn58Bi en_US
dc.subject Ag en_US
dc.subject Micro-alloy en_US
dc.subject Mechanical en_US
dc.subject Reliability en_US
dc.title Improved reliability and mechanical performance of Sn58Bi solder alloys en_US
dc.type info:eu-repo/semantics/article en_US
dc.type.supercollection all_ul_research en_US
dc.identifier.doi 10.20944/preprints201904.0136.v1
dc.contributor.sponsor IRCSET en_US
dc.relation.projectid EPSG/2014/48 en_US
dc.rights.accessrights info:eu-repo/semantics/openAccess en_US
dc.internal.rssid 2907886

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