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Magnetic properties and underlayer thickness in SmCo/Cr films

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Show simple item record Romero, S.A. Cornejo, D.R. Rhen, Fernando M.F. Neiva, A.C. Tabacniks, M.H. Missell, F.P. 2010-09-07T11:56:46Z 2010-09-07T11:56:46Z 2000
dc.description peer-reviewed en_US
dc.description.abstract SmCo films with a Cr underlayer have been investigated as potentially attractive candidates for high density recording media. Magnetron sputtering was used here to produce Cr/SmCox/Cr films on Si (100) substrates. The magnetic films were deposited at a substrate temperature of 350 °C and an Ar pressure of 5 mTorr. Cr underlayers were deposited both at 25 °C and at 350 °C and exhibited different textures. Layer thicknesses were evaluated using Rutherford backscattering spectroscopy, while SmCo grain size and underlayer texture were determined from a Rietveld analysis of x-ray diffraction data. The magnetic properties were measured with a vibrating sample magnetometer. The resulting films had in-plane coercivities in the range 4–8 kOe. For a SmCo layer with a thickness of 200 nm, the Cr underlayer thickness was varied in the range 75–300 nm to study its effect on intergranular coupling in the films. For thermally demagnetized samples, both magnetizing and demagnetizing remanence curves were measured and used to evaluate switching field distributions and δm plots. The underlayer texture was found to affect magnetic properties more strongly than underlayer thickness. en_US
dc.language.iso eng en_US
dc.publisher American Institute of Physics en_US
dc.relation.ispartofseries Journal of Applied Physics;87/ 9/ pp.6965-6967
dc.subject magnetic films en_US
dc.subject magnetization en_US
dc.title Magnetic properties and underlayer thickness in SmCo/Cr films en_US
dc.type Journal Article en_US
dc.type.supercollection all_ul_research en_US
dc.type.supercollection ul_published_reviewed en_US
dc.type.restriction none en
dc.contributor.sponsor CNPq (Conselho Nacional de Desenvolvimento Científico e Tecnológico –
dc.contributor.sponsor CAPES/MECD Cooperation Program
dc.contributor.sponsor FINEP

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