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Active cooling of a mobile phone handset

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Show simple item record Grimes, Ronan Walsh, Ed J. Walsh, Pat A. 2012-07-24T14:00:12Z 2012-07-24T14:00:12Z 2010
dc.description peer-reviewed en_US
dc.description This paper was obtained through PEER (Publishing and the Ecology of European Research)
dc.description.abstract Power dissipation levels in mobile phones continue to increase due to gaming, higher power applications, and increased functionality associated with the internet. The current cooling methodologies of natural convection and radiation limit the power dissipation within a mobile phone to between 1-2 W depending on size. As power dissipation levels increase, products such as mobile phones will require active cooling to ensure that the devices operate within an acceptable temperature envelop from both user comfort and reliability perspectives. In this paper, we focus on the applied thermal engineering problem of an active cooling solution within a typical mobile phone architecture by implementing a custom centrifugal fan within the mobile phone. Its performance is compared in terms of flow rates and pressure drops, allowable phone heat dissipation and maximum phone surface temperature as this is the user constraint for a variety of simulated PCB architectures in the mobile phone. Perforated plates with varying porosity through different size orifices are used to simulate these architectures. The results show that the power level dissipated by a phone for a constant surface temperature may be increased by ~50 - 75% depending on pressure drop induced by the internal phone architecture. Hence for successful implementation and efficient utilization of active cooling will require chip layout to be considered at the design stage. en_US
dc.language.iso eng en_US
dc.publisher Elsevier en_US
dc.relation.ispartofseries Applied Thermal Engineering;30(16), November, pp. 2363-2369
dc.rights This is the author’s version of a work that was accepted for publication in Applied Thermal Engineering. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Applied Thermal Engineering, 30(16), November 2010 doi10.1016/j.applthermaleng.2010.06.002 en_US
dc.subject mobile phone en_US
dc.subject active cooling en_US
dc.subject portable electronics en_US
dc.subject fan en_US
dc.subject forced convection en_US
dc.title Active cooling of a mobile phone handset en_US
dc.type info:eu-repo/semantics/article en_US
dc.type.supercollection all_ul_research en_US
dc.type.supercollection ul_published_reviewed en_US
dc.contributor.sponsor EI en_US
dc.rights.accessrights info:eu-repo/semantics/openAccess en_US
dc.internal.rssid 1121244

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